JPH02125371U - - Google Patents
Info
- Publication number
- JPH02125371U JPH02125371U JP3297189U JP3297189U JPH02125371U JP H02125371 U JPH02125371 U JP H02125371U JP 3297189 U JP3297189 U JP 3297189U JP 3297189 U JP3297189 U JP 3297189U JP H02125371 U JPH02125371 U JP H02125371U
- Authority
- JP
- Japan
- Prior art keywords
- chip elements
- bare chip
- wiring patterns
- circuit device
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3297189U JPH02125371U (en]) | 1989-03-23 | 1989-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3297189U JPH02125371U (en]) | 1989-03-23 | 1989-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125371U true JPH02125371U (en]) | 1990-10-16 |
Family
ID=31536277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3297189U Pending JPH02125371U (en]) | 1989-03-23 | 1989-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125371U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198769A (ja) * | 1985-02-28 | 1986-09-03 | Nec Corp | 混成集積回路 |
-
1989
- 1989-03-23 JP JP3297189U patent/JPH02125371U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198769A (ja) * | 1985-02-28 | 1986-09-03 | Nec Corp | 混成集積回路 |